The SMX-1000 Plus and SMX-1000L Plus X-ray inspection systems are a further refinement of the conventional models(SMX-1000 / SMX-1000L), which have become the benchmarks of the industry.
The operability so well received in the conventional models has been further improved, resulting in simple and easy-to-see windows. Fluoroscopic images and exterior images have been increased in size, providing a new level of visibility.
The measurement functions are much easier to use. Measurement results can now be obtained with a mouse click, with no need for complicated parameter settings.
New functions such as enhanced region-of-interest display have been incorporated, complementing a wealth of conventional functions including navigation via exterior images, step feed, teaching, and image browsing.

Both the SMX-1000 Plus and SMX-1000L Plus provide high-magnification nondestructive fluoroscopic examinations of junction conditions (disconnect, contact) of ultra-micro parts on high-density PCBs, BGAs, CSPs, or system LSIs.

To ensure that the intended operation is performed with no guesswork, windows have been increased in size and completely remodeled with a simple and easy-to-understand layout

As with the conventional models, combining a flat panel detector with Shimadzu image processing technology leads to clear, distortion-free images.

Performing fluoroscopy at an angle can help detect defects that are undetectable with vertical fluoroscopy.

Conventionally troublesome measurement parameter settings are automatically optimized thanks to our proprietary image processing technology, so measurement results are obtained with a mouse click.

Simply select a setting from the inspection condition list to immediately view the most suitable image of a part (material) without changing X-ray conditions, thanks to each image's wide dynamic range.

The stage can be positioned using an image from a CCD camera that can view the entire stage. This allows the stage to be immediately moved to the desired location.

Since all instrument operations can be performed using a PC mouse, operators can concentrate on the inspection using just the monitor screen. A useful “center shift” function moves the location clicked by the mouse to the center of the monitor screen.

This function moves the stage in even increments and improves the efficiency of inspections of samples with identical shapes, such as items placed on pallets.

This function moves the stage to a pre-registered inspection point. Registering an inspection point allows the stage to be moved quickly and improves inspection efficiency when repeatedly inspecting the same type of samples.

Displays images saved in a folder as thumbnails. As described below, this thumbnail display has a variety of functions to assist operators.

Distances between two points, angles, and curvatures can be measured. Previously, size calibration was required for each image, however, this instrument calibration data is calculated internally together with fluoroscopy magnification for more efficient measurement.

When measurement is started after setting a threshold, measurement results of all surface protrusions are displayed. Acceptance judgment is automatically performed based on preset acceptance criteria and measurement results can be saved in CSV format files.

The area ratio of an object in a specified ROI (region of interest) such as for die bond or solder wettability can be measured as the object area/ROI area value.

Wire sweep can be measured simply by clicking both ends of a wire and the maximum curve point and measurement results can be saved in CSV format files.

Attaching the removable rotate and tilt unit allows X-ray fluoroscopy of small parts from a variety of angles, helping to reduce chances of oversights.

Use the joystick and push-button switches on the operation box to manually move the table, change magnification, and operate the rotate and tilt unit.

* For improvement purposes, instrument appearance and specifications are subject to change without notice.